About us
Profil
The Cicor Group is a globally active provider of full-cycle electronic solutions from research and development to manufacturing and supply chain management. Cicor’s approximately 2,500 employees at 15 locations are serving leaders from the medical, industrial and aerospace & defence industries. Cicor creates value to its customers through the combination of customer-specific development solutions, high-tech components, as well as electronic device manufacturing. The shares of Cicor Technologies Ltd. are traded at the SIX Swiss Exchange (CICN).
Engineering Services
At the Cicor Group, more than 200 well-trained engineers work on customer projects and make the engineering department a unique selling point of the company thanks to their interdisciplinary competencies. Using efficient methods and tools, they support Cicor customers in the areas of hardware and software engineering, PCB layout and component selection, test engineering, tool design, printed electronics, and process and quality management throughout the entire product life cycle.
Electronic Manufacturing Services
Cicor is an international electronics service provider with a wide range of products and services in the fields of printed circuit board assembly, system assembly and box building, switchgear cabinet construction, cable assembly, tool design and fabrication and plastic injection molding. Cicor offers outsourcing solutions for the development and manufacture of electronic assemblies and complete devices and systems. As a globally active company with 15 production sites, the Group exploits synergies and offers solutions based on many years of know-how.
Precision Plastics
Leading companies in the medical technology and industrial sectors trust in Cicor as a production partner for high-precision plastic injection molded parts and mechanical assemblies.
Cicor supports customers with regard to tool design and fabrication through to series production of high-precision plastic parts and complete devices including electronic assemblies. The efficient cooperation of the development engineers with the production departments results in a close exchange of knowledge and technology.
Hybrid Circuits
Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) can be manufactured. Thin-film technology is using semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials.
The conductor tracks in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.
Printed Circuit Boards
For over 55 years, Cicor has been developing and producing sophisticated flexible, rigid-flexible and rigid printed circuit boards (PCBs), from the idea, through prototypes, to large-series production. Thanks to a comprehensive expertise in multilayer boards (MLBs) and high-density interconnects (HDIs), Cicor develops innovative and reliable solutions for demanding applications in medical, aerospace and defence and industrial markets.
Thin materials and line width and spacing down to 25 µm (1 mil) enable extreme miniaturization and ultra-HDI advanced solutions. DenciTec® technology opens up completely new possibilities.Innovative circuits can be produced by combining our PCB processes with our thin-film technology.
Printed Electronics
The increasing number of electronic devices in more and more applications requires new manufacturing technologies to be developed and industrialized. Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology.
The used Aerosol Jet Printing technology enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and shapes. In addition, new opportunities exist for interconnect technologies that lead to performance improvements.
The integration of the circuits into three-dimensional surfaces often eliminates the need to use additional substrates. Compared to the methods used today to produce such three-dimensional circuit carriers, the Aerosol Jet Printing technology offers a significantly wider variety of printed and printable materials. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using Aerosol Jet Printing technology.
With the opening of a technology center for printed electronics in Switzerland, Cicor underlines its ambition for technological leadership and its ambition to always be able to offer customers new and innovative solutions in addition to proven technologies.