About us
Microdul AG possesses a broad and pro-found know-how in the multi-faceted world of micro-electronics. In our business areas of semiconductors, modules and thick-film, we convert this know-how into fascinating products and services. Certifications in ISO 9001 and ISO 13485 are witnesses to our process excellence — as well as the numerous, successful customer audits. Whether you need a standard pro-duct or an individual solution — with Microdul as your partner, you will successfully cope with any hurdle.
Microdul masters the following process technologies and more:
- Miniaturisation of electronics
- Substrate Design
- Die and Wire Bonding (Al, Au), 15-350 um Wire Diameter
- Chip on Chip (COC), Chip on Ceramic, Chip on Board (COB), Chip on Flex (COB), Package on Package (POP)
- Globtop coating
- Flip chip assembly 150um pitch
- SMD mounting, 01005 Packages (0.2 x 0.4mm)
- Stud Bumping (Au) on Die and Wafer.
- Assembly on different substrates; flex rigid, thick film, thin film, Ceramic packages, direct copper bonding DCB
- Solder Ball Attach (BGA)
- Vacuum soldering (for power applications, CPV)
- Hand soldering
- Adhesive joining
- Heat sealing
- Laser trimming (active/passive)
- Module potting
- 100% Functional testing
- Failure analysis (X-Ray, X Section
- ISO 9001, ISO 13485 (quality management system for medical modules)
- ASIC Design (Low-Power, mixed Signal Arrays)
- Wafer Service, Microdul multiprojekt-wafer (MPW)